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Title:
AQUEOUS THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH06136240
Kind Code:
A
Abstract:

PURPOSE: To obtain an aqueous thermosetting resin composition having excellent merits of isocyanate curing type, having eliminated defects.

CONSTITUTION: An aqueous thermosetting resin composition comprises (A) an epoxy resin obtained by reacting (a) a compound containing one or more vinyl groups and one epoxy group in one molecule with (b) at least one of a polybasic acid anhydride, a polybasic acid, an acid end polymer and a carboxylic acid-containing polymer and (C) at least one of a compound containing one or more active hydrogen atoms to give a vinyl group-containing resin and further epoxidizing the resin, (B) a resin containing a hydroxyl group and a cationic group such as a resin prepared by reacting an epoxy group of a polyepoxy compound with an agent to make a cation as main components and a metal compound as a curing catalyst.


Inventors:
MAEDA KATSUYUKI
IKUI SOUZOU
HARANO YOSHIYUKI
Application Number:
JP29287992A
Publication Date:
May 17, 1994
Filing Date:
October 30, 1992
Export Citation:
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Assignee:
DAICEL CHEM
International Classes:
C08G59/14; C08G59/18; C08G59/34; C08G59/68; C08L63/00; (IPC1-7): C08L63/00; C08G59/14; C08G59/18; C08G59/34; C08G59/68