To provide an assembly of a plasma display device having improved heat dissipation.
The assembly of a plasma display device having improved heat dissipation includes: a panel assembly, a chassis base supporting it, a circuit board connected to the chassis base, a flexible printed cable whose both ends are connected to the panel assembly and the circuit board, and a heat radiation means which is installed in the chassis base on which the IC of the flexible printed cable is attached and dissipates heat generated from IC to an external part. The heat radiation means is installed at an end part of the chassis base which corresponds to the IC of the flexible printed cable. Thus, heat generated from IC at the time of driving can speedily be dissipated to the external part. Consequently, an operation temperature of the IC is appropriately maintained and reliability of the IC is improved.
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Masatake Shiga
Yasuhiko Murayama
Shinya Mitsuhiro