To electrically connect a lower transmission line and electrode pads formed on the upper side of a resin layer without forming an opening in the resin layer that provides insulation between an upper transmission line and the lower transmission line of a multilayer balun.
A balun-mounted device includes: a balanced signal transmission line 35 (only one side is shown) that is provided on a first insulating resin layer 22 formed on a substrate 10 and includes one end functioning as a balanced signal output/input terminal 35a and the other end functioning as a grounding terminal 35b; an unbalanced signal transmission line 50 that is provided on the top surface of a resin structure 24 having a trapezoidal cross section so as to oppose to the balanced signal transmission line 35 and includes one end functioning as an unbalanced signal input/output terminal 50a and the other end that is an open end; a balanced signal output/input lead 36 that extends from the top surface of another resin structure 24 through a side surface to the balanced signal output/input terminal 35a; and a grounding lead 37 that extends from the top surface of another resin structure 24 through a side surface to the grounding terminal 35b. The unbalanced signal input/output terminal 50a and the leads 36 and 37 have electrode pads 56, 57, and 59 respectively on the top surfaces of the resin structures 24.
COPYRIGHT: (C)2010,JPO&INPIT
AIZAWA TAKUYA
NAKAO SATORU
Tadashi Takahashi
Takashi Watanabe