PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD

Title:

PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD

Document Type and Number:

Japanese Patent JP2010123812

Kind Code:

A

Abstract:

To provide a plasma processing device and method for attaining long life improvement in a protected part so as to reduce exchange frequency of the protected part located in the outside of an object to be processed.

In the plasma processing device, a placing part 3 for placing an object S to be processed, and a gas supplying part 2 for supplying gas are provided in a processing chamber 1 the inside of which can be vacuum. The placing part 3 has a mask ring 33 arranged on the perimeter side of the object S to be processed, and the gas supplying section 2 has: a center side opening 22a and a medium opening 22b, located in the upper part of the object S to be processed, and supplying gas for the plasma processing; and a perimeter side opening 22c located in the upper part or outside of a mask ring 33 for supplying gas so as to produce a deposit in the mask ring 33.

Inventors:

OGAWARA SATOSHI

Application Number:

JP2008297327A

Publication Date:

June 03, 2010

Filing Date:

November 20, 2008

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SHIBAURA MECHATRONICS CORP

International Classes:

H01L21/3065; H01L21/304; H05H1/46

Attorney, Agent or Firm:

Kiuchi Mitsuharu

Previous Patent: PLASMA GENERATOR AND PLASMA PROCESSING APPARATUS

Next Patent: BALUN-MOUNTED DEVICE