Title:
BASE MATERIAL FILM FOR DICING FILM AND DICING FILM
Document Type and Number:
Japanese Patent JP2016162787
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a dicing film which is excellent in expandability and recoverability and can be used without the generation of wrinkle and sag and without adhesion to a stage even when thermal hysteresis is applied to a semiconductor wafer.SOLUTION: In a base material film for a dicing film including a base material layer 41 and a surface layer 42 that is arranged on one main surface of the base material layer, the base material layer includes a polymethylpentene resin. In the base material layer, the content of a polymethylpentene resin is preferably 60 mass% or more and 95 mass% or less, and an olefin elastomer is preferably included.SELECTED DRAWING: Figure 4
Inventors:
NAGAO YOSHINORI
Application Number:
JP2015037551A
Publication Date:
September 05, 2016
Filing Date:
February 27, 2015
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
H01L21/301; C09J11/06; C09J131/04; C09J133/08; C09J175/14; C09J201/00
Domestic Patent References:
| JP2012188597A | 2012-10-04 | |||
| JP2005129763A | 2005-05-19 | |||
| JP2002155249A | 2002-05-28 | |||
| JP2008147341A | 2008-06-26 | |||
| JP2008153431A | 2008-07-03 | |||
| JP2008153586A | 2008-07-03 |
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