Title:
SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD
Document Type and Number:
Japanese Patent JP2017142091
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce a time for substrate transfer from a hoop to a prescribed place in a substrate inspection device in an operation involving transferring a designated number of substrates from a hoop placed in a loader of the substrate inspection device to a prescribed place and then moving the hoop having remaining substrates placed therein for inspection by an another substrate inspection device.SOLUTION: Provided is a prober 100 for inspecting a wafer W, comprising: a loader 110 in which a plurality of wafers W are installed; a buffer 120 capable of temporarily storing the plurality of wafers W; an inspection unit 130 for inspecting the wafers W one at a time; and a conveyance mechanism 140 for conveying the wafers W between the loader 110, the buffer 120, and the inspection unit 130. The conveyance mechanism 140 is provided with a conveyance arm 170 capable of carrying in and carrying out the wafers W between the loader 110 and the buffer 120 while holding at least one or more wafers W collectively, and not doing carry-in and carry-out of the wafers W to and from the inspection unit 130.SELECTED DRAWING: Figure 2
Inventors:
OBIKANE TADASHI
Application Number:
JP2016022097A
Publication Date:
August 17, 2017
Filing Date:
February 08, 2016
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
G01R31/28; B65G49/07; H01L21/66; H01L21/677
Attorney, Agent or Firm:
Tetsuo Kanamoto
Miaki Kametani
Koji Hagiwara
Naoki Ogita
Miaki Kametani
Koji Hagiwara
Naoki Ogita