Title:
基板支持ユニット及びそれを含む基板処理装置
Document Type and Number:
Japanese Patent JP2012529173
Kind Code:
A
Abstract:
A substrate-supporting unit includes: a mounting board on which a substrate is disposed; and a heater installed in the mounting board to heat the substrate disposed on the mounting board, wherein the mounting board includes: a non-contact surface which faces a center portion of the substrate and is spaced apart from the center portion of the substrate; and a contact member which extends outward from the non-contact surface and is arranged along an edge portion of the substrate disposed on the mounting board to support the edge portion of the substrate.
Inventors:
Lee, Dong Gun
Zaretzsky, Sergey
Ze, Sonte
Oh
Zaretzsky, Sergey
Ze, Sonte
Oh
Application Number:
JP2012513852A
Publication Date:
November 15, 2012
Filing Date:
April 12, 2010
Export Citation:
Assignee:
Yu-Gen Technology Company Limited
International Classes:
H01L21/205; C23C16/458; H01L21/31
Domestic Patent References:
| JP2002134484A | 2002-05-10 | |||
| JP2000164588A | 2000-06-16 | |||
| JPH11111707A | 1999-04-23 |
Attorney, Agent or Firm:
Michiaki Nagai