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Title:
BUILDING MATERIAL
Document Type and Number:
Japanese Patent JP2002060280
Kind Code:
A
Abstract:

To provide a preferable building material containing rubber chips.

The building material in which rubber chips are bonded together by a cement-based material in a porous matrix is formed by mixing the cement- based material, the rubber chips and water.


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JP3819837METHOD FOR MANUFACTURING HEAT INSULATING PANEL, HEAT INSULATING PANEL AND APPLICATION METHOD FOR HEAT INSULATING PANEL
Inventors:
LEE KIN MAN AMAZON
LUI LAI CHUEN LOUIS
LEUNG KWONG CHIU
Application Number:
JP2000376881A
Publication Date:
February 26, 2002
Filing Date:
December 12, 2000
Export Citation:
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Assignee:
EARTH LINK TECHNOLOGY ENTPR LT
International Classes:
B28B1/08; B28B1/14; C04B18/22; C04B28/02; C04B38/00; E01C3/00; E01C5/06; E01C7/14; E02D17/18; E02D17/20; E02D29/02; (IPC1-7): C04B38/00; B28B1/08; B28B1/14; C04B18/22; E02D17/18
Attorney, Agent or Firm:
Takao Igarashi (3 outside)



 
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