BURN-IN TEST DEVICE, AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING THE DEVICE

Title:

BURN-IN TEST DEVICE, AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING THE DEVICE

Document Type and Number:

Japanese Patent JP3854419

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To stably secure a contact resistance between a pad (electrode) of a socket substrate and a bump electrode in a burn-in test for a semiconductor device of which the external connection terminal is composed of the bump electrode.
SOLUTION: Plural pads 4 formed integrally with a wiring 3 are formed in a main face of a socket substrate mounted on a socket of a burn-in test device, and plural protrusions 5 are provided on a surface of each pad 4. A height and a protrusion-to-protrusion distance of the protrusion 5 is specified not to bring a lower end of a soldering bump connected to the protrusion 5 into contact with the surface of the pad 4.

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Inventors:

Kenichi Yamamoto
Yoshio Arima
Akio Hasebe
Kenichiro Morinaga
Ichiro Anjo

Application Number:

JP3703499A

Publication Date:

December 06, 2006

Filing Date:

February 16, 1999

Export Citation:

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Assignee:

Renesas Technology Corp.

International Classes:

G01R1/073; G01R31/26; H01L21/66; H01L21/60; (IPC1-7): G01R31/26; H01L21/66; H01L21/60

Domestic Patent References:

JP11026128A
JP7063786A
JP5003233A
JP9271981A

Foreign References:

WO1999001775A1

Attorney, Agent or Firm:

Yamato Tsutsui

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