固体触媒を含むCMP研磨パッド - CABOT MICROELECTRONICS CORPORATION

Title:

固体触媒を含むCMP研磨パッド

Document Type and Number:

Japanese Patent JP2004532509

Kind Code:

A

Abstract:

A polishing pad comprising a polishing pad substrate and at least one solid catalyst, the polishing pad being useful to remove metal layers from a substrate.

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Inventors:

Mueller, Brian El.
Wang, Shumin

Application Number:

JP2002558441A

Publication Date:

October 21, 2004

Filing Date:

January 16, 2002

Export Citation:

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Assignee:

CABOT MICROELECTRONICS CORPORATION

International Classes:

B24B37/24; B24D3/00; B24D3/02; B24D3/34; C09G1/02; C09K3/14; C23F3/00; H01L21/304; H01L21/321; (IPC1-7): H01L21/304; B24B37/00; B24D3/00; B24D3/02; C09K3/14

Attorney, Agent or Firm:

Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Masaya Nishiyama

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