To solve the problem that when a semiconductor wafer is polished by holding the semiconductor wafer on a carrier plate with a polishing fluid charging port, and by putting it between polishing pads, a side surface orthogonal to the polishing surfaces of the polishing pads in the polishing fluid charging port cuts the polishing pads, causing a shortened life of the polishing pads and nonuniform flatness of the semiconductor wafer; and the problem that when the polishing pads are fixed abrasive grain pads, chips containing the abrasive grains impair the semiconductor wafer.
In the carrier plate 5 with the polishing fluid charging port 51 formed therein, a chamfered portion 510a is formed at a portion contacting the polishing pads 60 and 61 in an inner peripheral surface 510 that is the side surface orthogonal to the polishing surfaces 60a and 61b of the polishing pads 60 and 61. This prevents the polishing pads 60 and 61 from being cut by the carrier plate 5.
COPYRIGHT: (C)2011,JPO&INPIT
| JP2004283929A | 2004-10-14 | |||
| JP2006100786A | 2006-04-13 |
Kyoko Kawamura
Ken Kubo
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