Title:
キャビティ構造のアンテナパッケージ
Document Type and Number:
Japanese Patent JP6987999
Kind Code:
B2
Abstract:
An antenna package having a cavity structure is provided, wherein a cavity substrate having an accommodation portion formed therethrough is disposed on one surface of an antenna substrate having a signal processing element formed thereon, so as to prevent occurrence of deformation and breakage thereof in the process of mounting the antenna package. The provided antenna package having the cavity structure comprises: an antenna substrate, on the upper surface of which multiple radiation patches are formed and on the lower surface of which multiple signal processing elements are formed; and a cavity substrate which has an accommodation portion formed therethrough to receive the multiple signal processing elements and is disposed on the lower surface of the antenna substrate.
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Inventors:
Park, Hyunju
Baek, Hyunil
Yu, Kyung Hyun
Lee, Seho
Seo, Yun Sik
Go, Gwang Young
Do, Hanju
Baek, Hyunil
Yu, Kyung Hyun
Lee, Seho
Seo, Yun Sik
Go, Gwang Young
Do, Hanju
Application Number:
JP2020536753A
Publication Date:
January 05, 2022
Filing Date:
October 18, 2018
Export Citation:
Assignee:
Amotech Co., Ltd.
International Classes:
H01Q23/00; H01P5/19; H01Q21/06
Domestic Patent References:
| JP2015023360A |
Attorney, Agent or Firm:
Kyosei International Patent Office
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