Title:
CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2021082704
Kind Code:
A
Abstract:
To provide a ceramic electronic component and a manufacturing method thereof that can suppress a mounting defect without performing a step of removing a water repellent.SOLUTION: A multilayer ceramic capacitor comprises: a laminated chip which has a substantially rectangular parallelepiped shape and is formed in such a manner that a plurality of dielectric layers containing ceramic as a main component and a plurality of internal electrode layers 12 are laminated, and the plurality of laminated internal electrode layers are exposed to at least one of two opposite end faces; a pair of external electrodes formed on the two end faces; and a water repellent provided on the surface of the external electrode, and the thickness A (>0) of the water repellent on at least one of the four surfaces covering the upper surface, the lower surface, and the two side surfaces of the laminated chip in the lamination direction, of the external electrode is larger than the thickness B (≥0) of the water repellent on the surface covering the end face of the laminated chip in the external electrode.SELECTED DRAWING: Figure 2
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Inventors:
YATAGAWA SEISHIRO
UBUKATA HARUNA
UBUKATA HARUNA
Application Number:
JP2019208881A
Publication Date:
May 27, 2021
Filing Date:
November 19, 2019
Export Citation:
Assignee:
TAIYO YUDEN KK
International Classes:
H01G4/30; H01G2/06; H01G2/10
Attorney, Agent or Firm:
Shuhei Katayama