To provide a ceramic electronic part having external electrode surfaces which are dense and requires no plating, and to provide its manufacturing method.

The ceramic electronic part 1 comprises a ceramic sintered body 2, and external electrodes 7, 8 which are formed by applying a conductive paste as an electrode material comprising metal particles and glass frits to the outer surfaces of the ceramic sintered body 2, followed by baking. The average particle size of the metal particles in the external electrode surface layers is 3μm or below, and a rate of glass distribution area in the external electrode surfaces is in a range of 3-10% by characteristic X-ray analysis. The method for manufacturing the ceramic electronic part 1 comprises steps of preparing the ceramic sintered body 2 whose thickness is 80μm or below, applying the conductive paste having an average particle size of 3μm or below to the outer surfaces of the ceramic sintered body 2, and baking the conductive paste to form the external electrodes 7, 8.