Title:
CHEMICAL MECHANICAL POLISHING METHOD
Document Type and Number:
Japanese Patent JP2010219556
Kind Code:
A
Abstract:
To provide a chemical mechanical polishing method that prevents oxidation, corrosion, or other trouble from occurring to a sample having been polished.
A pedestal pad (sample table pad) 125 is arranged on a pedestal (sample table) where a wafer (sample) before or after polishing is temporarily mounted. The pedestal pad 125 is formed of resin, and at least a surface which comes into contact with the wafer absorbs no liquid, has fine and smooth texture, and does not have gaps such as pores wherein liquid is held.
Inventors:
SHIRASU TETSUYA
Application Number:
JP2010135310A
Publication Date:
September 30, 2010
Filing Date:
June 14, 2010
Export Citation:
Assignee:
FUJITSU SEMICONDUCTOR LTD
International Classes:
H01L21/304; B24B37/04; H01L21/683
Domestic Patent References:
JPH11312658A | 1999-11-09 | |||
JP2003053661A | 2003-02-26 | |||
JP2003071709A | 2003-03-12 | |||
JP2003011056A | 2003-01-15 | |||
JP2000156363A | 2000-06-06 | |||
JPH03148124A | 1991-06-24 | |||
JPH0413568A | 1992-01-17 |
Attorney, Agent or Firm:
Keizo Okamoto
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