Title:
ウェーブ形状のグルーブを有する化学的機械的研磨パッド
Document Type and Number:
Japanese Patent JP2005500689
Kind Code:
A
Abstract:
Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with a plurality of concentric wave-shaped grooves having different radiuses while having the same shape. Each groove has a desired depth, width, and shape. The chemical mechanical polishing pad provides effects of effectively controlling a flow of slurry during a polishing process, thereby achieving a stability in the polishing process in terms of a polishing rate, and achieving an enhancement in the planarization of a wafer.
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| JPS60119726 | WAFER PROCESSING DEVICE |
Inventors:
Park, Inn-Ha
Kim, Jae-suk
Huang, In-ju
Kuon, Tae Kyung
Kim, Jae-suk
Huang, In-ju
Kuon, Tae Kyung
Application Number:
JP2003522156A
Publication Date:
January 06, 2005
Filing Date:
August 29, 2001
Export Citation:
Assignee:
SK Company, Limited
International Classes:
B24B37/04; B24B37/26; B24D13/14; B24B37/00; H01L21/304; H01L21/306; (IPC1-7): H01L21/304; B24B37/00
Attorney, Agent or Firm:
Calyx
Miyazaki Yoshio
Toshio Nakamura
Tsutomu Kato
Kaoru Onozuka
High Masahiro
Yusuke Murakoshi
Tomoaki Komiya
Miyazaki Yoshio
Toshio Nakamura
Tsutomu Kato
Kaoru Onozuka
High Masahiro
Yusuke Murakoshi
Tomoaki Komiya