Title:
チップパッケージ及びその製造方法
Document Type and Number:
Japanese Patent JP7093859
Kind Code:
B2
Abstract:
A chip package includes a semiconductor substrate, a first light-transmissive sheet, a second light-transmissive sheet, a first antenna layer, and a redistribution layer. The first light-transmissive sheet is disposed over the semiconductor substrate, and has a top surface facing away from semiconductor substrate and an inclined sidewall adjacent to the top surface. The second light-transmissive sheet is disposed over the first light-transmissive sheet. The first antenna layer is disposed between the first light-transmissive sheet and the second light-transmissive sheet. The redistribution layer is disposed on the inclined sidewall of the first light-transmissive sheet, and is in contact with an end of the first antenna layer.
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Inventors:
Chung Jiaming
Zhang Yinmei
Zhang Yinmei
Application Number:
JP2021000050A
Publication Date:
June 30, 2022
Filing Date:
January 04, 2021
Export Citation:
Assignee:
Precision Materials Technology Co., Ltd.
International Classes:
H01L23/29; H01L23/12; H01L23/31; H01L25/04; H01L25/18; H01Q1/38; H01Q1/40
Domestic Patent References:
| JP2009500821A | ||||
| JP2010098274A | ||||
| JP2012222366A | ||||
| JP2001527700A | ||||
| JP2009283944A |
Foreign References:
| WO2019026913A1 |
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toshihiro Kobayashi