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Patent Searching and Data


Title:
CHIPPING-RESISTANT INTERLAMINAR COATING COMPOSITION
Document Type and Number:
Japanese Patent JPH03273064
Kind Code:
A
Abstract:

PURPOSE: To prepare the title compsn. giving a coating film which prevents spot-like peeling of a topcoating film when an impact force is applied and is excellent in flexibility, elasticity, and surface flatness by incorporating a specific flexible resin component into a specific interlaminar coating compsn.

CONSTITUTION: 100 pts.wt. interlaminar coating compsn. which contains a major component comprising a polyester component (e.g. a polyester resin) and a crosslinker component for curing the main component (e.g. a butylated melamine resin) and is used to form a coating film between coating film layers, such as between an intercoating film and an electrodeposition coating film is compound with 4-10 pts.wt. flexible resin component which reacts with the main and/or the crosslinker component and has a flexible part in the molecule (e.g. a butadiene resin having a glycidyl group and a terminal hydroxyl group in the molecule), thus giving the title compsn.


Inventors:
FUKAMI TATSUO
YAMASHITA HIDEO
HANABUSA SHINICHI
Application Number:
JP7298890A
Publication Date:
December 04, 1991
Filing Date:
March 22, 1990
Export Citation:
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Assignee:
AISIN CHEM
International Classes:
C09D5/00; (IPC1-7): C09D5/00
Attorney, Agent or Firm:
Hiroshi Okawa