Title:
結合性が改良された回路材料およびその製造方法と製造物品
Document Type and Number:
Japanese Patent JP2011517112
Kind Code:
A
Abstract:
A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.
Inventors:
Bath, Dirk M
Paul and thunker
Paul and thunker
Application Number:
JP2011504021A
Publication Date:
May 26, 2011
Filing Date:
February 13, 2009
Export Citation:
Assignee:
World Properties Incorporated
International Classes:
H05K1/03; C08K3/22; C08K5/3492; C08L9/00; C09D7/61; H05K3/46
Domestic Patent References:
| JPH09227784A | 1997-09-02 | |||
| JP2002290054A | 2002-10-04 | |||
| JP2009081356A | 2009-04-16 | |||
| JP2001339131A | 2001-12-07 | |||
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Foreign References:
| WO2007023944A1 | 2007-03-01 |
Attorney, Agent or Firm:
Sakaki Morishita