PURPOSE: To realize a small size as a whole by a method wherein a chip component at both ends of which electrodes have been formed is buried, in the longitudinal direction, in a molded body of an insulating resin and patterns used to connect the electrodes of the chip component are formed on the surface and the rear surface of the molded body.

CONSTITUTION: Square holes 2 are made in a holding body 1 in a matrix shape; and chip components 3 at which electrodes 4, 5 have been formed at both ends are passed through and inserted into the square holes 2; tip parts 8a, 9a of terminals 8, 9 are inserted into square holes 6, 7. The holding body 1 is outsert- molded by a resin; a molded body 10 is formed; a pattern 11 which is in continuity to the electrodes 4 of the chip components 3 and to the tip parts 8a of the terminals 8 is printed and formed on the surface of the molded body 10; a pattern which is in continuity to the electrodes 5 of the chip components 3 and to the tip parts 9a of the terminals 9 is printed and formed on the rear surface; and a circuit module is constituted. Thereby, the are occupied by the components 3 can be made small and the compact circuit module can be obtained.