洗浄具、基板洗浄装置及び基板洗浄方法

Japanese Patent JP6969434

B2

To provide a technique for cleaning a side surface of a wafer containing a bevel part at high efficiency when cleaning a back surface of the wafer and the bevel part.SOLUTION: A cleaning apparatus for cleaning a back surface of a wafer W, provides a lower surface side brush part 60 that is rotated in a vertical axial periphery in the cleaning apparatus, and a peripheral side brush part 70 independent from the lower surface side brush part 60 at a position opposite to the wafer W held in a spin chuck 3 in the lower surface side brush part 60. When the peripheral side brush part 70 is positioned at an outer side from an outer periphery of the wafer W in a state where the lower surface side brush part 60 is pressed to the back surface of the wafer W, it is structured that the height becomes higher than that of an upper end of a bevel part on a lower surface side of the wafer W. Further, an inclined plane higher than a height dimension of the bevel part on the lower surface side of the wafer at a lower side portion in the peripheral side brush part 70 is provided, and a vertical surface is provided in an upper direction of the inclined plane.SELECTED DRAWING: Figure 9

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Yoshitaka Matsuda
Teruhiko Kodama
Akihiro Kubo

JP2018029107A

November 24, 2021

February 21, 2018

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東京エレクトロン株式会社

H01L21/304; H01L21/027

JP201223209A
JP200170896A
JP20103739A
JP201016156A

Patent Corporation Yayoi Patent Office
Toshio Inoue

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