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Title:
COMPOUND LIGHTWEIGHT RIBBON WIRE, INSULATED COMPOUND LIGHTWEIGHT RIBBON WIRE, AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP2000113730
Kind Code:
A
Abstract:

To provide a compound lightweight ribbon wire capable of soldering, weight saving, and capable of making light and compact electronic devices etc., and having good heat releasing performance, and to provide an insulated compound lightweight ribbon wire obtained by providing the ribbon wire with insulating coating, also to provide a manufacturing method thereof.

A zinc thin film 2 is formed on the surface of a stretching pure aluminum conductor 1 having an outside diameter of less 1.0 mm and an aluminum purity of more 90%, by a zincate conversion process. A copper coating 3 is formed on the outer surface of the zinc thin film 2 by electroplating with copper, to form a copper coating aluminum conductor 4a. Then, the copper coating aluminum conductor 4a is made into a copper coating aluminum wire 4b of the desired size by cold plastic forming, thereafter it is further formed into the compound lightweight ribbon wire 4 of the desired size by cold rolling work.


Inventors:
KITAZAWA HIROSHI
YAMAGUCHI TATSUO
OTANI KOICHI
TSUKADA ETSURO
Application Number:
JP28238098A
Publication Date:
April 21, 2000
Filing Date:
October 05, 1998
Export Citation:
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Assignee:
TOTOKU ELECTRIC
International Classes:
H01B5/02; C25D7/06; H01B7/08; H01B13/00; H01B13/16; (IPC1-7): H01B5/02; C25D7/06; H01B7/08; H01B13/00; H01B13/16