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Title:
CONDUCTIVE COMPOSITION AND APPLICATION THEREOF
Document Type and Number:
Japanese Patent JP2006077229
Kind Code:
A
Abstract:

To provide a conductive composition comprising an aqueous solvent-soluble resin and an aqueous solvent-soluble conductive polymer represented by formula(1), having a π-electron conjugated system and exerting conductivity through electronically conductive mechanism.

The conductive composition attains the electrical resistance reduction and the improvement of the conductivity of coating film, therefore being suitably applicable to conductive coatings, coating film, coated products and the anode buffer layers of organic electronics devices, etc.


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Inventors:
OKUBO TAKASHI
SAIDA YOSHIHIRO
TANAKA ATSUSHI
Application Number:
JP2005147686A
Publication Date:
March 23, 2006
Filing Date:
May 20, 2005
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
C08L65/00; C08G61/12; C08L101/14; C09D5/24; C09D101/26; C09D165/00; C09D179/02; C09D201/00; C09K11/06; H01B1/12; H01B1/20; H01B13/00; H01L51/50; C09K3/16
Domestic Patent References:
JP2003213148A2003-07-30
JP2004099678A2004-04-02
JP2004139819A2004-05-13
JP2003039010A2003-02-12
JP2002089543A2002-03-27
Foreign References:
WO1997007167A11997-02-27
Attorney, Agent or Firm:
Kunihisa Landlord
Nobuhiko Ozawa
Atsushi Hayashi



 
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