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Title:
CONDUCTIVE POLYAMIDE RESIN COMPOSITION AND CONDUCTIVE POLYAMIDE FILM
Document Type and Number:
Japanese Patent JP2011225630
Kind Code:
A
Abstract:

To provide a conductive polyamide film enhanced in both conductivity and formability (film-formation performance).

The conductive polyamide film is obtained by forming a conductive polyamide resin composition containing a polyamide resin and a conductivity imparting agent. The polyamide resin (polyamide 5X) has structure equivalent to a polycondensation body which is obtained by polycondensation reaction using diamine containing pentamethylene diamine and a carboxylic acid as monomers, an ash component residuum of the conductive polyamide resin composition is not higher than 0.5 wt.%, and a volume resistivity value is not higher than 1.00×108 Ωcm. By using the polyamide 5X as the polyamide resin, the polyamide film excellent in conductivity can be obtained at a small blending quantity of the conductivity imparting agent, and accordingly, without impairing characteristics such as the formability (film-formation performance) and flexibility.


Inventors:
HITOMI TATSUYA
YAMAMOTO MASANORI
KUSANO KAZUNAO
TSUNODA MORIO
WATABE TAKESHI
Application Number:
JP2010080936A
Publication Date:
November 10, 2011
Filing Date:
March 31, 2010
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP
International Classes:
C08L77/06; C08J5/18; C08K3/04; C08K7/24
Domestic Patent References:
JP2005508425A2005-03-31
JP2004182866A2004-07-02
JP2004269549A2004-09-30
JP2004269634A2004-09-30
Attorney, Agent or Firm:
Tsuyoshi Shigeno