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Title:
COOLER FOR PREFORM, AND RECEIVING AND COOLING METHOD FOR PREFORM
Document Type and Number:
Japanese Patent JP3761017
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a cooler for a preform wherein the preform taken out from a mold can be efficiently cooled, and a receiving and cooling method for the preform.
SOLUTION: After a bottomed cylindrical preform P taken out from a mold for injection molding is received, an arrangement interval of the preform is shortened, a bottom part is protruded downwards, the preform is mounted on a preform pallet 20, cooled by blowing an air upwards toward a bottom part of the preform P from below the preform pallet 20, and discharged by conveying in conformance to the following process. Thereby, the preform received from the mold can be efficiently cooled by air from below on the preform pallet.


Inventors:
Ueda Masahiro
Application Number:
JP28399299A
Publication Date:
March 29, 2006
Filing Date:
October 05, 1999
Export Citation:
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Assignee:
Toyo Seikan Co., Ltd.
International Classes:
B29C49/64; B29C45/72; B29C49/06; (IPC1-7): B29C49/64; B29C49/06
Domestic Patent References:
JP7171888A
Attorney, Agent or Firm:
Takuji Harada
Toru Sakamoto