Title:
冷却装置
Document Type and Number:
Japanese Patent JP7399742
Kind Code:
B2
Abstract:
To improve cooling performance.SOLUTION: A cooling device 1 cools a heating element 2. The cooling device 1 comprises: a storage part 10 for storing a refrigerant 3 in a liquid phase; and a plate-like porous part 30 provided above the heating element 2, and to which heat of the heating element 2 is transferred. A side surface 30a of the porous part 30 is in contact with the refrigerant 3 stored in the storage part 10. An upper surface 30b of the porous part 30 is exposed from a liquid surface 3a of the refrigerant stored in the storage part 10.SELECTED DRAWING: Figure 1
Inventors:
Takahiro Yamana
Tsutomu Kawamizu
Yuta Watanabe
Tsutomu Kawamizu
Yuta Watanabe
Application Number:
JP2020032254A
Publication Date:
December 18, 2023
Filing Date:
February 27, 2020
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES,LTD.
International Classes:
F28D15/02; F28D15/04
Domestic Patent References:
| JP2019038100A | ||||
| JP2017083130A | ||||
| JP2017112334A | ||||
| JP4091459A |
Attorney, Agent or Firm:
Takaharu Fujita
Takaori Mitoma
Miki Kawakami
Daisuke Nagata
Takaori Mitoma
Miki Kawakami
Daisuke Nagata