Title:
COPPER-CLADDING SHEET WITH ADHESIVE
Document Type and Number:
Japanese Patent JP2002275434
Kind Code:
A
Abstract:
To provide an inexpensive copper-cladding sheet with adhesive high in adhesivity to copper foil and suitable for use in flexible printed wiring boards.
This sheet with adhesive is such that at least one side of an organic insulating sheet is laminated with a copper-cladding adhesive layer; wherein the organic insulating sheet is characterized by comprising a thermoplastic resin including at least one kind selected from (A-1) a noncrystalline polyester and (A-2) an aromatic polycarbonate.
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Inventors:
KOBAYASHI SADAYUKI
KARASAWA HIROO
KARASAWA HIROO
Application Number:
JP2001079644A
Publication Date:
September 25, 2002
Filing Date:
March 21, 2001
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
B32B7/02; B32B15/08; B32B15/09; B32B27/36; C09J7/02; C09J163/00; C09J167/00; C09J177/00; C09J179/08; (IPC1-7): C09J7/02; B32B15/08; B32B27/36
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