Title:
硬化性エポキシ組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体
Document Type and Number:
Japanese Patent JP6458921
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curable epoxy composition having excellent storage stability and an excellent wiring embedding property, and capable of forming an electrical insulation layer having excellent heat resistance (for example, solder heat resistance) and adhesivity to a conductor layer, and a film, a laminated film, a prepreg, a laminate, a cured article, and a composite obtained by using the same.SOLUTION: Provided is a curable epoxy composition comprising an epoxy compound (A), an active ester compound (B), a phenol novolac resin (C), and an imidazole compound (D), in which the imidazole compound (D) has no substituent on the nitrogen atom at 1 position and a charge amount of the nitrogen atom at 3 position, as calculated by a semi-empirical molecular orbital method, is -0.121 or more. Also provided are a film, a laminated film, a prepreg, a laminate, a cured article, and a composite obtained by using the same.
Inventors:
Takayuki Saito
Makoto Fujimura
Makoto Fujimura
Application Number:
JP2014034942A
Publication Date:
January 30, 2019
Filing Date:
February 26, 2014
Export Citation:
Assignee:
INTEL CORPORATION
International Classes:
C08G59/40; B32B15/092; C08J5/24; H05K1/03
Domestic Patent References:
| JP2014005464A | ||||
| JP2012153885A | ||||
| JP2013082873A | ||||
| JP2011132507A |
Foreign References:
| WO2014038534A1 | ||||
| WO2013146647A1 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation