PURPOSE: To obtain an insulating film pattern free from cracks of ≥2μm size by patterning a photosensitive polyimide resin precursor with a developer consisting of an aprotic polar solvent and water or further contg. an org. solvent.
CONSTITUTION: A preferred example of an aprotic polar solvent is N,N-dimethylformamide, N,N-dimethylacetoamide, dimethylsulfoxide, N-methyl-2-pyrrolidone, 1, 3-dimethyl-2-imidazolidinone or N-acetyl--caprolactam, and ion exchanged water is desirably used as water from the requirement of the semiconductor industry. The preferred amount of water blended with the solvent is 10W50wt% basing on the total weight of the resulting developer. A conventional org. solvent may be added as a tertiary component. Development is carried out by an immersion method or a spraying method, and development by immersion is finished in 1W5min at room temp. The developed picture is rinsed to remove the developing solvent.
| JPS55100548 | DEVELOPER |
| WO/2002/031596 | CO2-PROCESSES PHOTORESISTS, POLYMERS, AND PHOTOACTIVE COMPOUNDS FOR MICROLITHOGRAPHY |
| JP3035421 | MOUNTING STRUCTURE FOR PAIRED ROLLER |
KATAOKA FUMIO
SHIYOUJI FUSAJI
KOJIMA MITSUMASA
HITACHI CHEMICAL CO LTD
| JPS56110728A | 1981-09-02 | |||
| JPS5645915A | 1981-04-25 | |||
| JPS5638038A | 1981-04-13 | |||
| JPS5622428A | 1981-03-03 | |||
| JPS564630A | 1981-01-19 |