Title:
DIE-BONDING COMPOSITION
Document Type and Number:
Japanese Patent JPH02271639
Kind Code:
A
Abstract:
PURPOSE: To provide a die bonding material, which has high resistance against ionizing radiation and can be softened a lot of times, by composing it of specified polyetherimide, namely, specified ortho-dichlorobenzene, methacresol and polyetherimide. CONSTITUTION: This component is composed of polyetherimide composed of bisphenol-A-double anhydride and pyromelitic acid double anhydride in 11-33wt.%, methacresol in 9-28wet.% and ortho-chlorobenzene in 47-78wt.%. Therefore, a die bonding method is improved by using a solvent system for dissolving the partially or completely dried die bonding material. Thus, the die bonding material, which has high resistance against the ionizing radiation and can be softened a lot of times, can be provided.
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Inventors:
ROBAATO JIYON UOJINAROUSUKII
CHIYAARUZU UIRIAMU EICHIERUBAA
CHIYAARUZU UIRIAMU EICHIERUBAA
Application Number:
JP4084190A
Publication Date:
November 06, 1990
Filing Date:
February 21, 1990
Export Citation:
Assignee:
GEN ELECTRIC
International Classes:
C09J179/08; H01L21/52; H01L21/58; H01L23/538; (IPC1-7): C09J179/08; H01L21/52
Attorney, Agent or Firm:
Tadao Hirata (2 outside)
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