Title:
ELECTROLESS PLATING METHOD IN NONAQUEOUS SOLVENT
Document Type and Number:
Japanese Patent JP2013241648
Kind Code:
A
Abstract:
To provide a method for forming a uniform metal film by electroless plating on a surface of not only a water-insoluble substrate but also a water-soluble substrate.
An electroless plating method comprises: placing a film deposition substrate 20 inside a container 30 in an inert gas 34 atmosphere; and, after filling a nonaqueous solvent 32, mixing a Lewis base comprising a metal complex and a Lewis acid comprising a group 13 element halide into the nonaqueous solvent 32, thereby depositing a metal film 10 on a surface of the film deposition substrate 20.
Inventors:
ABE HIDEKI
MURAKAMI HIDEYUKI
NOR AKMAL FADIL
SARAVANAN GOVINDACHETTY
TANABE TOYOKAZU
VENKATA RAMESH GUBBALA
MURAKAMI HIDEYUKI
NOR AKMAL FADIL
SARAVANAN GOVINDACHETTY
TANABE TOYOKAZU
VENKATA RAMESH GUBBALA
Application Number:
JP2012115600A
Publication Date:
December 05, 2013
Filing Date:
May 21, 2012
Export Citation:
Assignee:
NAT INST FOR MATERIALS SCIENCE
International Classes:
C23C18/31; C23C26/00
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