To provide an electrolytic copper foil with a carrier foil which can be used in a press molding temperature region at 230°C or lower and uses an organic agent in a bonding interface layer.

The electrolytic copper foil 1a with the carrier foil is equipped with the bonding interface layer 2 on one face of the carrier foil C, and is equipped with an electrolytic copper foil layer CF on the bonding interface layer 2. The bonding interface layer 2 is formed by using a solution containing triazine thiols. The triazine thiols here is especially preferably 2-anilino-4,6-dimercapto-s-triazine.