To provide an electronic component mounting system and an electronic component mounting method capable of mounting a shield component at a proper height dimension and with a sufficient bonding strength.
The electronic component mounting method includes: an inspection step for inspecting for any foreign matter in a region 23, where a wall of the mounted shield component 22 is positioned, is set after mounting an electronic component 21 on a first soldering part S1 for bonding the electronic component and before mounting a shield component 22 on a second soldering part S2 for bonding the shield component; and a second electronic component mounting step in which the shield component 22 is mounted after mounting the shield component 22 on a board 3 where is determined that no foreign matter is included in the inspection step. With this, the shield component 22 is prevented from being solder-bonded with a foreign matter included. Thus, the shield component 22 can be mounted at a proper height dimension.
OKAMOTO KENJI
ISHIMOTO KENICHIRO
OKAMURA HIROSHI
Daisuke Nagano
Kentaro Fujii
Next Patent: TAPE FEEDER