Title:
END PLATE ELECTRODE FOR LAYER-BUILT CELL
Document Type and Number:
Japanese Patent JP3170984
Kind Code:
B2
Abstract:
PURPOSE: To provide an end plate electrode having no chamfer in which no reaction is caused on the electrode reverse surface by the penetration of an electrolyte by nipping both surfaces of a current taking metal mesh by plates having specified compositions, respectively, followed by thermocompression bonding to form an electrode, and welding a frame body to the electrode.
CONSTITUTION: Of plates for nipping a current taking metal mesh 25, the surface-side (upper-side) plate is formed of a blend of polyethylene, carbon black and graphite, and the reverse-side (lower-side) plate is formed of a blend of polyethylene, silica and graphite. These are thermocompression bonded to form an electrode 31, which is then welded to one surface of a frame body 22 and integrated together to form an end plate electrode.
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Inventors:
Kenichiro Jinnouchi
Application Number:
JP31760493A
Publication Date:
May 28, 2001
Filing Date:
December 17, 1993
Export Citation:
Assignee:
KABUSHIKI KAISHA MEIDENSHA
International Classes:
H01M4/88; H01M4/96; H01M12/08; (IPC1-7): H01M4/88; H01M12/08
Domestic Patent References:
| JP343956A | ||||
| JP61284059A | ||||
| JP268870A | ||||
| JP422070A | ||||
| JP4259754A | ||||
| JP589886A | ||||
| JP5166548A | ||||
| JP59215667A | ||||
| JP59139574A | ||||
| JP241366U | ||||
| JP6215769U |
Attorney, Agent or Firm:
Fujiya Shiga (1 person outside)