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Title:
EPOXY RESIN, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JP3476584
Kind Code:
B2
Abstract:

PURPOSE: To obtain an epoxy resin which can give a cured product excellent in heat resistance, water resistance and mechanical strengths by selecting a specified epoxy resin.
CONSTITUTION: This epoxy resin represented by formula I (wherein n is a positive number representing the average value and being desirably 0.01-5; P and Q are each halogen, 1-8C alkyl or aryl; G is glycidyl; and X is H or G, provided that 0-95% of nXs are glycidyl groups) is selected. This is obtained, for example by reacting a compound represented by formula II with an epihalohydrin in the presence of an alkali metal hydroxide to synthesize an epoxy resin wherein all of nXs are H atoms in the formula I and then reacting the obtained epoxy resin with an epihalohydrin in the presence of dimethyl sulfoxide, a quat. ammonium salt or 1,3-dimethyl-2-imidazolidinone and an alkali metal hydroxide.


Inventors:
Yasumasa Akatsuka
Kenichi Kuboki
Yoshiro Shimamura
Hiromi Morita
Hiroaki Ohno
Application Number:
JP6895395A
Publication Date:
December 10, 2003
Filing Date:
March 03, 1995
Export Citation:
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Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA
International Classes:
C08G59/06; C08G59/20; C08G59/24; (IPC1-7): C08G59/24; C08G59/06
Domestic Patent References:
JP8208802A
JP7292066A
JP6271654A
JP3285909A
JP7196568A