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Title:
EPOXY RESIN CONTAINING INDOLE NUCLEUS, EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREFROM
Document Type and Number:
Japanese Patent JP2006249420
Kind Code:
A
Abstract:

To provide an epoxy resin which gives the epoxy resin cured product usable suitably for the applications such as the sealing of electrical/electronic components.

The epoxy resin containing an indole nucleus is expressed by formula (1): H-L-(X-L)n-H, wherein L is a group expressed by formula (2) or formula (3); and X is a group expressed by formula (a) or formula (b).


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Inventors:
YAMADA HISAFUMI
KAJI MASASHI
Application Number:
JP2006030633A
Publication Date:
September 21, 2006
Filing Date:
February 08, 2006
Export Citation:
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Assignee:
NIPPON STEEL CHEMICAL CO
TOTO KASEI CO LTD
International Classes:
C08G59/04; C08G59/20; H01L23/29; H01L23/31
Domestic Patent References:
JP2006117790A2006-05-11
JP2003301031A2003-10-21
JP2002105166A2002-04-10
JP2004238501A2004-08-26
Foreign References:
WO2006043524A12006-04-27
WO2003068837A12003-08-21
Attorney, Agent or Firm:
Katsuo Naruse
Tomohiro Nakamura
Eiichi Sano



 
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