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Title:
Etching material
Document Type and Number:
Japanese Patent JP6131959
Kind Code:
B2
Abstract:
An etching material including at least one boron compound selected from a Lewis acid that includes, in its structure, boron and a halogen that is bonded to the boron, a salt of the Lewis acid and a compound that generates the Lewis acid.

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Inventors:
Nakao Takeo
Kamidai Yasushi
Takaaki Nado
Maki Inada
Kyoko Kuroda
Application Number:
JP2014541938A
Publication Date:
May 24, 2017
Filing Date:
October 11, 2013
Export Citation:
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Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L21/308; C09K13/08; C09K13/10; H01L21/306; H01L31/0216
Domestic Patent References:
JP2008527698A
JP2010512028A
JP11121442A
JP2010087154A
JP2003531807A
JP11060275A
Foreign References:
WO2010139390A1
Attorney, Agent or Firm:
Kihei Watanabe
Yuko Tanaka
Koji Hirayama
Takeshi Sato



 
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