Title:
EXPOSURE CONTROL APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2011044554
Kind Code:
A
Abstract:
To provide an exposure control apparatus for exposing a shot of a wafer circumference with high yield and high efficiency.
The exposure control apparatus includes an exposure presence-setting unit 12 that performs an exposure setting of setting an exposure shot as a shot that is exposed or a shot that is not exposed based on height information on a height of the wafer in the exposure shot arranged in the after circumference, and an exposure instructing unit 14 that outputs an exposure instruction to the shot that is exposed and an instruction to skip an exposure to the shot that is not exposed by the exposure presence-setting unit 12.
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Inventors:
FUJISAWA TADAHITO
Application Number:
JP2009191259A
Publication Date:
March 03, 2011
Filing Date:
August 20, 2009
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L21/027; G03F7/207
Attorney, Agent or Firm:
Hiroaki Sakai
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