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Title:
FILM FOR BACK SURFACE OF FLIP-CHIP TYPE SEMICONDUCTOR AND USAGE OF THE FILM
Document Type and Number:
Japanese Patent JP2014039046
Kind Code:
A
Abstract:

To provide a film for a back surface of a flip-chip type semiconductor, the film capable of efficiently diffusing heat from a semiconductor element to the outside even when the film is arranged on a back surface of the semiconductor element, while maintaining laser marking property on a film surface and adhesiveness to a semiconductor wafer or the like.

The film for a back surface of a flip-chip type semiconductor is arranged on a back surface of a semiconductor element to be connected to an adherend by flip-chip mounting. The film contains a thermally conductive filler, in which the content of the thermally conductive filler is 50 vol% or more; and with respect to the thickness of the film, the average particle diameter of the thermally conductive filler is 30% or less and the maximum particle diameter is 80% or less.


Inventors:
TAKAMOTO HISAHIDE
SHIGA GOSHI
ASAI FUMITERU
Application Number:
JP2013188601A
Publication Date:
February 27, 2014
Filing Date:
September 11, 2013
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
H01L23/28; C09J7/00; C09J7/02; C09J11/02; C09J201/00; H01L21/301; H01L23/00
Domestic Patent References:
JP2006140348A2006-06-01
JP2008106231A2008-05-08
JP2005072220A2005-03-17
JP2010108969A2010-05-13
JP2008106231A2008-05-08
JP2010077389A2010-04-08
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office



 
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