Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FILM FORMATION SUBSTRATE PROCESSING DEVICE
Document Type and Number:
Japanese Patent JPH06177030
Kind Code:
A
Abstract:

PURPOSE: To accurately remove a coating film in a specified pattern by providing with a developer tank that holds developer of enough amount for the entire substrate to be submerged in and an overflow tank that receives the overflowed developer from the develop tank.

CONSTITUTION: A pair of guides 38, 38 that vertically support a substrate 16, a holder 18 in which desired numbers of 38, 38 are provided in parallel, and a developer tank 14 that holds enough amount of developer for the entire substrate 16, supported by the holder 18, to be submerged in, are provided. In addition, an overflow tank 32 that allows flowing-in of the developer overflowed out of the developer tank 14 is provided. Further a liquid supply part 20, comprising a discharge part 58 that discharges the developer upward along the surface of respective substrates 16, is provided, so that the developer in the overflow tank 32 is circulation-supplied to the liquid supply part 20. With this, a coating film formation surface of the substrate 16 can always be supplied with the developer with no degradation, so the coating film is surely removed with a specified pattern left as it is.


Inventors:
IRIE KANJI
Application Number:
JP35039792A
Publication Date:
June 24, 1994
Filing Date:
December 02, 1992
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAIDO STEEL CO LTD
International Classes:
G03F7/30; H01L21/027; H01L21/30; (IPC1-7): H01L21/027; G03F7/30
Attorney, Agent or Firm:
Kimoto Yamamoto



 
Previous Patent: Digital relay

Next Patent: FORMATION OF RESIST PATTERN