PURPOSE: To make it possible to provide a fine pattern formation method whose sheet resistance value is lower by directly printing organic metal ink on a ceramic or glass base material, drying and calcining the base material to form a pattern and metal-plating the pattern thus produced at a specified thickness by an electrolytic metal plating process.

CONSTITUTION: Organic metal ink is directly printed on a ceramic or glass base material, which is dried and calcined so as to form a pattern. The pattern thus formed is plated based on an electrolytic metal plating process so that the metal film may be 1 to 3μm thick. The organic metal ink comprises one class or two or more classes of organic metal compounds or organic metal complex salt selected from the groups of gold, silver, copper, palladium, ruthenium, rhodium, iridium, nickel, copper, and chrome. The organic metal compound is a product available by allowing aliphatic calboxylic acid or mercaptane to be reacted with metal inorganic salt. The organic metal complex salt includes acetylacetone and amine complex. A plating bath should be selected, which meets the requirements that it is precise and near the bulk in terms of its sheet resistant value.