Title:
FLUX COMPOSITION FOR SOLDERING AND ELECTRONIC CIRCUIT BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2015208770
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a flux composition for soldering, which is excellent in solderability, in which stickiness is sufficiently suppressed after soldering, and which has excellent appearance.SOLUTION: A flux composition for soldering of this invention contains: (A) a solvent, (B) a rosin-based resin; and (C) an activator. The (A) component contains: (A1) a dicarboxylic acid having 4-8 carbon atoms and a dicarboxylic acid ester composed of alcohol having 1-7 carbon atoms; (A2) a glycol-based solvent whose boiling point at 760 mmHg is 220°C or more; and (A3) a hydrocarbon-based solvent whose boiling point at 760 mmHg is 145°C or less.
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Inventors:
KUMAKURA ICHIRO
NAKANAMI KAZUTAKA
OGAWA YASUTAKA
TOTSUKA YOSHIHIRO
NAKANAMI KAZUTAKA
OGAWA YASUTAKA
TOTSUKA YOSHIHIRO
Application Number:
JP2014092837A
Publication Date:
November 24, 2015
Filing Date:
April 28, 2014
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK
International Classes:
B23K35/363; B23K1/00; B23K1/08; H05K3/34
Domestic Patent References:
| JP2007136491A | 2007-06-07 | |||
| JP2012071337A | 2012-04-12 | |||
| JP2013188761A | 2013-09-26 | |||
| JPH0377792A | 1991-04-03 | |||
| JP2002361483A | 2002-12-18 | |||
| JP2014117745A | 2014-06-30 | |||
| JP2014188549A | 2014-10-06 | |||
| JP2015160244A | 2015-09-07 |
Attorney, Agent or Firm:
Intellectual Property Office
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