Title:
FORMING METHOD FOR PACKAGE OF SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPS59104149
Kind Code:
A
Abstract:
PURPOSE: To prevent the deformation of the longest leads by coupling the longest leads of outside to a frame, to which no lead is coupled through a supporting bar, and forming at least part of the bar within a projecting area of a thermoplastic resin plate-shaped molded component.
CONSTITUTION: A leadframe is formed of tabs 12 supported to frames 10, 10' of X direction and a plurality of leads groups 13, 13' extending from the frames 11, 11' of Y direction to the tabs 12. Four lead 14 which form the outsides of the groups 13, 13' are respectively coupled to the frames 10, 10' via supporting bars 15. The bars 15 are formed to be disposed within the projecting area of a plate- shaped molded component 16.
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Inventors:
ARAI TOSHIYUKI
HAZAMA KEIJI
OOTA SHINICHI
KANAMARU KIICHI
HAZAMA KEIJI
OOTA SHINICHI
KANAMARU KIICHI
Application Number:
JP21374682A
Publication Date:
June 15, 1984
Filing Date:
December 06, 1982
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H01L23/08; H01L23/495; H01L23/50; (IPC1-7): H01L21/56; H01L23/48
Domestic Patent References:
| JPS55146952A | 1980-11-15 | |||
| JPS55146951A | 1980-11-15 |
Attorney, Agent or Firm:
Kunihiko Wakabayashi