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Title:
FULL BODY CUTTING METHOD OF BRITTLE MATERIAL
Document Type and Number:
Japanese Patent JP2009040665
Kind Code:
A
Abstract:

To achieve high speed cutting in full-body thermal-stress cutting of a brittle material where the upper limit of the speed is the stress propagation speed.

The full-body thermal-stress cutting of a brittle material 2 is conducted by separating into two processes of thermal-stress generation and crack spreading. The thermal-stress generation is made by concentrating irradiated laser beams 8 onto a concentration point 10 of a glass plate 2 with a concentration lens 9 and scanning linearly in the scanning direction 3. The crack spreading starts at an initial crack 12, proceeds along the laser scanning line in the reverse direction 11 opposite to the scanning direction 3 of the irradiated laser beams 8 and reaches the start point of laser irradiation. Since the thermal-stress cutting of the brittle material is separated into two processes of generation of thermal-stress distribution and crack spreading, the upper limit of which is the stress propagation speed, speed-up of both processes can be achieved each under independent conditions thereby overall speed-up of thermal-stress cutting phenomenon can be achieved.


Inventors:
KARUBE MITSUJIRO
Application Number:
JP2007210583A
Publication Date:
February 26, 2009
Filing Date:
August 12, 2007
Export Citation:
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Assignee:
LEMI LTD
International Classes:
C03B33/09; B23K26/38; B23K26/40; B28D5/00