ｃ−Ｍｅｔ抗体およびＶＥＧＦ結合断片が連結された融合タンパク質

Title:

ｃ−Ｍｅｔ抗体およびＶＥＧＦ結合断片が連結された融合タンパク質

Document Type and Number:

Japanese Patent JP6636684

Kind Code:

B2

Abstract:

There are provided a fusion protein formed by coupling of anti-c-Met antibody and VEGF-binding fragment, a bispecific antibody comprising the fusion protein, a polynucleotide encoding the fusion protein, a transformant comprising the polynucleotide, a pharmaceutical composition comprising the bispecific antibody as an active ingredient, and a method for preparing the bispecific antibody which is targeted at c-Met and VEGF at the same time, with improved anticancer and anti-angiogenesis effects, comprising coupling an anti-c-Met antibody with a VEGF-binding fragment.

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Inventors:

Song Yang So
Song Ho Hoi
Lee Seung
Homage to gold
Zheng Leopard

Application Number:

JP2014067216A

Publication Date:

January 29, 2020

Filing Date:

March 27, 2014

Export Citation:

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Assignee:

Samsung Electronics Co.,Ltd.

International Classes:

C07K19/00; A61K39/395; A61P3/10; A61P27/02; A61P35/00; A61P43/00; C07K16/22; C07K16/28; C12N15/00; C12P21/08; G01N33/574

Other References:

国際公開第2012/069557号
国際公開第2012/162561号
国際公開第2010/045344号
特表2009-505989号公報
欧州特許出願公開第2316484号明細書

Attorney, Agent or Firm:

Hatta International Patent Corporation

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