Title:
GRINDING DEVICE AND GRINDING METHOD
Document Type and Number:
Japanese Patent JP2016112649
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve followability of the control of a cutting speed with respect to the fluctuation of a grinding load.SOLUTION: A grinding device 1 comprises: feeding mechanisms (7, 8) for bringing an abrasive 5 into contact with a workpiece 20 by moving the rotating abrasive 5 and the workpiece 20 relatively; an AE sensor 10 for detecting acoustic emission generated at the time of grinding the workpiece 20 by the abrasive 5; and a control unit 11 for feedback-controlling a cutting speed of the abrasive 5 with respect to the workpiece 20 on the basis of an output signal A of the AE sensor 10.SELECTED DRAWING: Figure 1
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Inventors:
NAKAYAMA YUSUKE
GOTO TAKESHI
ONITSUKA YUKI
GOTO TAKESHI
ONITSUKA YUKI
Application Number:
JP2014254120A
Publication Date:
June 23, 2016
Filing Date:
December 16, 2014
Export Citation:
Assignee:
NSK LTD
International Classes:
B24B49/16; B24B5/00; B24B49/10; G05B19/416
Domestic Patent References:
| JP2008093788A | 2008-04-24 | |||
| JPS6362676A | 1988-03-18 | |||
| JP2010076004A | 2010-04-08 | |||
| JP2012161906A | 2012-08-30 | |||
| JPH03113753U | 1991-11-21 |
Attorney, Agent or Firm:
Tetsuya Mori
Suzuki Isobe
Hide Tanaka Tetsu
Ichi Hirose
Toru Miyasaka
Suzuki Isobe
Hide Tanaka Tetsu
Ichi Hirose
Toru Miyasaka
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