Title:
研削装置
Document Type and Number:
Japanese Patent JP6850631
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a grinding device configured to accurately measure residual dressing amounts.SOLUTION: The grinding device comprises: a wafer chuck for holding a wafer; grinding means having a grind stone 21 for grinding the wafer; and a unit comprising a dress board for dressing the grind stone 21 and a dress base mechanism that supports the dress board rotatably. A touch sensor 84 measures residual dressing amounts while suppressing the touch sensor 84 from being abraded, by contacting a dress material 81a through a water film WF formed on the dress material 81a which is rotating.SELECTED DRAWING: Figure 7
Inventors:
Tobiyama Hirotsugu
Application Number:
JP2017035591A
Publication Date:
March 31, 2021
Filing Date:
February 27, 2017
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B53/02; B24B7/04; B24B49/10; B24B55/02; H01L21/304
Domestic Patent References:
| JP2014161944A | ||||
| JP52005084A | ||||
| JP2006269906A | ||||
| JP2001129755A |
Attorney, Agent or Firm:
Takamitsu Shimizu