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Title:
GROUND FORMING METHOD
Document Type and Number:
Japanese Patent JP2003020604
Kind Code:
A
Abstract:

To impart heat insulating property (heat retaining property), simplify paving, and improve workability.

When forming the ground by treating a surface of a soil layer g, a heat insulating independent layer s comprising a volume reduced body (an EPS: particles abound in strength and heat retaining property with an exterior in a hardened state and an interior holding fine bubbles of air) of half- melted foamed polystyrene as foamed plastic particles using waste is provided with an even thickness on the surface of the soil layer g.


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Inventors:
SHIMOIE MASAHARU
ONUMA KAZUTO
SASAKI HIDEYUKI
SAKAI KOJI
FUJIWARA TADASHI
Application Number:
JP2001204651A
Publication Date:
January 24, 2003
Filing Date:
July 05, 2001
Export Citation:
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Assignee:
IWATE KENKO KK
IWATE PREFECTURE
FUJIWARA TADASHI
International Classes:
E02D31/14; E01C3/06; (IPC1-7): E01C3/06; E02D31/14
Domestic Patent References:
JPH01226914A1989-09-11
JPH06220804A1994-08-09
JP2001146707A2001-05-29
JPH01230801A1989-09-14
JPH10140514A1998-05-26
JPH05271655A1993-10-19
Attorney, Agent or Firm:
Yusaku Maruoka



 
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