Title:
HEAT TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP2003194478
Kind Code:
A
Abstract:
To provide a compact, low-cost heat treatment device capable of preventing a lowering of treating quality even in the case of heating a treated object of large dimensions or heating the treated object at a high temperature.
A heating source 2 for heating the treated object W of plate shape is arranged in a heating chamber 1, and the heating source 2 is provided with a thin film heater 3 with a pattern 3a for heating the treated object W, prepared to uniformize the internal temperature distribution of the treated object W, and first and second glass (insulating members) 4, 5 for holding the thin film heater 3 in the state of covering the pattern 3a.
Inventors:
KITAMURA HIROSHI
Application Number:
JP2001394424A
Publication Date:
July 09, 2003
Filing Date:
December 26, 2001
Export Citation:
Assignee:
KOYO THERMO SYS KK
International Classes:
F27D11/02; (IPC1-7): F27D11/02
Attorney, Agent or Firm:
Takafumi Watanabe (1 person outside)