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Title:
HEATING DEVICE, MOLDING DEVICE AND HEATING METHOD
Document Type and Number:
Japanese Patent JP2010097870
Kind Code:
A
Abstract:

To provide a heating device capable of efficiently performing heating at an accurate temperature.

In the heating device 10 configured to heat an external heating object through a block member 3 by closely fitting the block member 3 to a heating block 1 with a plurality of built-in cartridge heaters 2 by use of a fixing member 5, an adjustment member 4 having a linear expansion coefficient 4 larger than the linear expansion coefficient 3 of the block member 3 and the linear expansion coefficient 5 of the fixing member 5 is interposed between a major diameter part 5b of the fixing member 5 and the block member 3. Accordingly, when heating from ordinary temperature to a predetermined set temperature, formation of a clearance between the block member 3 and the fixing member 5 due to the thermal expansion difference is compensated by the thermal expansion of the adjustment member 4 to surely maintain the fastening force of the block member 3 to the heating block 1 by the fixing member 5, whereby further uniform and efficient heat transfer from the heating block 1 to the block member 3 is attained.


Inventors:
IIJIMA HIDETO
Application Number:
JP2008268940A
Publication Date:
April 30, 2010
Filing Date:
October 17, 2008
Export Citation:
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Assignee:
OLYMPUS CORP
International Classes:
H05B3/72; B29C33/02; B29L11/00
Attorney, Agent or Firm:
Yoshiyuki Osuga



 
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